Update for Group 1 of Tool Move:
| Tool Name | Date to be disconnected | Date to be operational* |
|---|---|---|
| EV 420 Aligner | 08/22/13 | 09/12/13 |
| EVG 520 IS Wafer Bonder | 08/22/13 | 09/12/13 |
| Heidelberg MicroPG 101 Mask Writer | 09/03/13 | 09/12/13 |
| Laser Mark 4000 Nd-YAG | 08/22/13 | 09/05/13 |
| Optec Micromaster KrF | 08/22/13 | 09/05/13 |
| Strasbaugh 6EC CMP | 08/22/13 | 09/05/13 |
* Subject to inspection and occupancy approval
Details:
To support the contractor work and utility connection in the SMBB nanofab we will need to disconnect and move equipment. The first items moving are the EV 420 aligner and Ev 520 wafer bonder. We plan to disconnect and move out on Thursday 8/22/13. The Heidelberg uPG101 Mask writer is in this group, we hope to delay disconnect and move until ~ Tuesday 9/3. We hope to have release and approval to power up best case ~ 9/10 with return to available status within 1-2 days.
For 8/22 move we plan to add on packaging equipment – NdYAG Laser Mark, Optec KrF laser and CMP for move into CMP room. Down time for packaging equipment should be less than 2 weeks.
We anticipate the Group 2 (remaining research photo/litho) equipment to begin disconnect and move after the Group 1 is operational.