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Equipment Training or Service Request

Equipment Selection (Only pick one tool from any section)

Tool choice for training or service.

For which tool do you want training or service? ALD Cambridge FIJI F200E-Beam Denton SJ20CMOCVD Agnitron Imperium Ga2O3, GeOParylene SCS PDS 2010Sputter Denton Discovery 18Sputter Denton 635Sputter TMV SUPEREV 420OAI 200OAI 800SUSS MA1006Oxford Cobra PECVDSi DRIE/SiO2/SiN Etch OXFORD 100 ICPSi DRIE OXFORD COBRA 200mmMETAL RIE PLASMATHERMO2 RIE TECHNICS PE II-ASi Isotropic Etch XACTIX X2 XEF2RTP ALLWIN ACCUTHERMO AW 610BLUE-M BOX FURNACELPCVD CTR FURNACESOxide PROTEMP CLEAN OXDiffusion PROTEMP DOPED OXDPSS UV LASER MARKERUNIVERSAL LASER PLS6.150DFILM STRESS TENCOR FLX-23204-POINT PROBE MICROTECH RF-1Film Thickness NANOSPEC 3000Film Thickness N AND K 1500 ANALYZERStep Height PROFILOMETER TENCOR P-10Step Height PROFILOMETER TENCOR P-20HKEYENCE VHX-5000 MICROSCOPEBINDER FD53-ULMEMMERT GLASS 250MEMMERT N2 300YES HMDS1YES LP-IIIVWR 1410 VACUUM OVENMARCH PLASMOD BARREL RIE – OENERCON DYNE-A-MITE OZONE PLASMACEE 200X PDMS SPINNERDISCO DAD3220DISCO DAD641EVG 520 ISMEI WEDGEHEIDELBERG DWL66+HEIDELBERG MICROPG 101HEIDELBERG MICROPG 101-2-0.9UMNANOSCRIBE 3D PHOTONIC PRO GTNANOFRAZOR EXPLOREPhotolithographyCEE 100CEE 200X 1800 SPINNERCEE 200X 9260 SPINNERCEE 200XD DEVELOP SPINNERHEADWAY EC101KEITHLEY 4200 SCSOscilloscope Tektronix TDS 2002 BMicromaniuplator Probe StationCHA E-beam Evaporator

Set up

Is this a training or service? * TrainingService

What HSC account will be billed? *

Enter the date of your Safety Training Walk-Through. *

If you have not had a Safety Training Walk-Through you cannot schedule training services.

User Information

First Name *

Last Name *

Email Address *

Substrate

Substrate Material * SiliconGlassQuartzSapphireOther Substrate Material

Substrate size (mm) *

Substrate thickness (mm) *

Number of Substrates to fabricate/inspect/test *

Other Description

Films

What Films are already on the substrate? List in order on both sides. *

What thickness are the films in nanometers? *

What pre-existing patterns are on the films? *

Preferred Training Schedule

Pick 3 different dates. Preferred training date and time will depend on tool and staff availability.

1st Preferred Training Date *

1st Preferred Training Time *

080910111213141516 : 0030

2nd Preferred Training Date *

2nd Preferred Training Time *

080910111213141516 : 0030

3rD Preferred Training Date *

3rd Preferred Training Time *

080910111213141516 : 0030

Dicing Section

Please select the tape type to be used for dicing. * Blue Tape (130um thickness)UV Tape (160um thickness) Requires UV exposure to release

Blade thickness * .250 (Silicon, Glass, Quartz).090 (Silicon)Other Blade thickness

How is your device being protected during the dicing process? * Device is covered with photoresistDevice is covered with blue tape.Device is covered with UV tape.Other How is your device being protected during the dicing process?

Does your device have alignment marks to use for dicing? YesNo

List the X dimension (mm) of your device or streets. *

List the Y dimension (mm) of your device or streets. *

Special instructions.

File Upload

Drop a file here or click to upload Choose File

Maximum file size: 419.43MB

Upload a drawing of your device to show device, tape, films, etc.

The fields below are to be used by Staff.

Blade type used for project VT07 SD400 VC100 75 57x0.25A3x40-L #400 (35um)P1A850 SD320R10MB01 58x0.250x40 #320 (46.2um)P1A851 SD600R10B01 54x0.25x40 #600 (25.8 um)NBC-Z 1070 52x0.09x40 #1500 (12.6um)NBC-Z 1050 53x0.07x40 #2000 (10.3um)B1A801 SD200N75M42 56x0.15x40 #200 (75um)Z09-SD4800-Y1-60 51.8x0.04ASx40 #4800 (~5um)Other Blade type used for project

Dicing Speed

Notes

Inspection & Metrology Tools

Describe details for measurements.

3D Microprinting (Nanoscribe)

Overall print dimensions (x, y, z)

List the dimensions (x, y, z)

Minimum feature size

List the minimum feature size.

Desired resin

List the desired resin

Objective

10X

25X

65X

Upload STL File

Drop a file here or click to upload Choose File

Maximum file size: 419.43MB

Mask making (Heidelbergs)

Minimum feature size

Overall design dimensions X by Y

Dark field or light field

Dark Field

Light Field

Alignment Marks

Street widths/dicing spacing

Design CAD file type:

DFX

GDS

OtherOther

Upload CAD File for review

Drop a file here or click to upload Choose File

Maximum file size: 419.43MB

Wirebonding

Chip size X, Y, Z in mm

Chip bond pad details

HeightHeight

WidthWidth

ThicknessThickness

MaterialMaterial

Package size X, Y, Z in mm

Photolithography

Spinner *

Substrate *

Material *

Liftoff or etch mask?

Lift off

Etch mask

Material to be lifted off or etched

Thickness of layer(s) to be lifted off or etched?

Substrate precleaning (Acetone/IPA, O2 RIE, Piranha, hot plate bake, etc)

HMDS adhesion promotor required?

Deposition

What materials do you want to deposit? *

What thickness are the materials in nanometers? *

Captcha

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