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    • Fabrication Procedures

      • Photolithography Spin/Bake/Expose/Develop

        • +S1813 Photoresist

        • nLOF 2020 Photoresist

        • LOR 10B Photoresist

        • AZ 9260 Photoresist

  • EM Surface Analysis Lab

    • Get Access to the Electron Micrsocopy and Surface Analysis Lab

    • Request EMSAL staff to analyze a sample for you

    • Capabilities

    • Staff Consultation

    • On-Campus Rates

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  • Services

    • Nanoscribe Photonic Pro GT2 Micro 3D Printing Service (2 Photon Polymerization)

    • Heidelberg DWL66+ Photomask Production and Direct Writing or Grayscale Lithography Service

    • Precious Metals Coating and Patterning (Gold, Platinum, Silver, Iridium, Palladium)

    • Wafer Dicing and Anodic Bonding

    • Custom Biochip Fabrication (microfluidic channels, neural probes, microneedles)

    • Micro/Nano Imaging (Optical and SEM Videos and Microphotographs)

    • WAFER OR THIN FILM ETCHING/PATTERNING: (DRIE, ICP RIE, XeF2 dry silicon isotropic etch, O2 plasma, or wet chemical )

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Binder FD53-UL

December 12, 2022

Tool Owner

Brian Baker (bbaker@eng.utah.edu)

Reservations Calendar

Download Files

Files

SOP:

Binder FD SOP

Spec sheet:

Binder FD-53 data sheet.pdf

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