Tool Owner
Jim Pierce (jim.pierce@utah.edu)
Reservations Calendar
- Sputter deposition of metals, alloys, and insulating thin films (user configurable)
- Film thicknesses controllable from a few nm to hundreds of nm
- Three 3″ diameter confocal cathodes
- 2 RF power supplies
- Switchable DC power supply
- Co sputter capable
- Reactive sputtering available (Nitrogen or Oxygen)
- 6″ Diameter stage
- Substrate rotation
- +/- 10% Uniformity
- Cryo and turbo pumped to 1 x 107 Torr
- Substrate heat up to 200 C
- Liftoff deposition with sputter power
- Argon pressure range 2-50 mT controllable with 200 sccm MFC controller (no APC valve)
- S/N 18003
Targets Available
Metals/Alloys:
Ag, Al, Al/Si, Au, C, Chromel, Co, Cr, Cu, Cu/Ag, Ge
Ir, Fe, Ni, NiCr, NiCrFe, Nb, Pd, Pt, Si (p-type), Ta, Ti, TiW, V, W
Oxides / Ceramics:
Al2O3, SiO2 ITO, BN, CeSm(ox), LaSrFe(ox), NaMnO3, NdMgO, SiC, Si3N4, TaO2, TiO2,
YNiZrO, YSZ, ZnO
Deposition Rates:
| Material | Cathode | Supply (DC or RF) | Power (W) | Rate (nm/min) | Argon % | Notes |
| Cu | 1 | DC | 50 | 0.4 | 40 | |
| SiO2 | 2 | RF | 100 | 1.7 | 60 | Dep 30 minutes with 5 min cooling between deps |
| Ti | 3 | DC | 165 | 0.3 | 40 | |
| Ti/Nb | Ti(3) Nb (2) | DC and RF | 165 DC / 300 RF | 0.625 | 40 | Need to close gate and increase pressure to strike. |
Training Video: https://www.youtube.com/watch?v=-kzvwDqwa9c&feature=youtu.be
Process Information
Download Files
Files
Characterization:
Characterization Data 2012-08-20
Denton Sputter Characterization Aug 2011
Member Files
SOP:
Staff Files
Logs:
Denton Sputter Log Sheet -Archive-
Denton Sputter Rates and Process Parameters Archive
Manual:
AdvancedEnergy-MDX1.5K-PowerSupply manual
AdvancedEnergy-RFX600generator manual
Cryp comp-Running Purge Procedure
MKS-247powersupply-readout manual
MKS-PDR-C-1CpowerSupply manual
Omega-76000TempController manual
Spec Sheet:
Denton 18 System specifications.pdf