Heidelberg DWL66+

Tool Owner

Joe Jacob (joseph.jacob@utah.edu)

Reservations Calendar

DWL 66+ System Specifications

Resolution

  • High Resolution write head: 300nm
  • 5mm write head: 800nm
Write Time for 100mm wafer or photomask
  • Hi-Resolution: 2 days
  • 5mm write head: 4 hours
Grayscale direct writing
Substrates up to 200mm wafer diameters and 9″x9″ photomasks
Pneumatic and optical autofocus (OAF works only with reflective substrates, transparent substrates only work with pneumatic)
DWL66+
300nm lithography dwl66

Member Files

System Specifications:

DWL 66- Specs