Tool Owner

Brian Baker (bbaker@eng.utah.edu)

Reservations Calendar

• S/N DWL646
• Accepts DXF/CIF/BMP file formats
• 3 um minimum feature size (Smaller features possible)
• 3″ x 3″, 4″ x 4″, 5″ x 5″ chromium masks and direct wafer write
• Light field or dark field selectable in system control software

SOFTWARE:

• L-Edit CAD Layout Software
• AutoCAD software
• Intellisuite and Cadence design and simulation software (CADE lab)
• DXF/GDSII/CIF file software conversion tools

PROCEDURE:

MASK MAKING STEPS

Consult with Nanofab staff regarding microfabrication process flow and mask design.

Design mask using AutoCad or LEdit

Mask size depends on wafer size, typically:

1. 2” and 3” diameter wafers: 4” mask

1. 4” diameter wafers: 5” mask

Mask polarity depends on deposition and etch processing:

1. Liftoff using positive photoresist – Dark field (Transparent where film should remain after liftoff)

1. Etching using positive photoresist – Light field (Opaque where film should remain after etch)

GENERAL DESIGN RULES:
• Keep in mind that defined areas will be exposed.
• Do not use special characters (spaces, punctuation marks, umlauts ..) in the design name.
• The design coordinate origin must be the center of the design.
• If possible, create the whole design in only one layer. If several layers are used, they will be merged using an OR function.
• All polylines must be closed. Keep in mind that interiors of polyline structures will be filled out completely, covering any structures within.
• Do not cross polylines, or create doubled vertices (vertices with no distance between them). This will create data errors.
• Do not use single lines without width.
• Limits:

DXF SPECIFIC DESIGN RULES:
• Use a 100% AutoCAD compatible editor.
• The design has to be created in metrical units.
• As far as possible, only use the structure types “polyline”, “circle”, and “text”.
• Only one text font is provided. This will replace any other font used in the design creation. The only supported text attributes are “rotated”, “mirrored”, and “scaled”.
• Try to use as few layers as possible. All layers will be merged via an OR operation.
• Do not use special characters in the layer names.
• Polylines with width must not change their width (tapered lines).
• When inserting blocks, the same scaling has to be used for x and y.
• External blocks are not supported.

BMP SPECIFIC DESIGN RULES:
• Maximum image file size is 4 GB.
• For grayscale exposures, use 8-bit format. The 256 gray values will be interpolated down to 100 gray values.
• Create the design in a 90° counter-clockwise rotated version, as the design will be rotated 90° clockwise during data processing.

CIF SPECIFIC DESIGN RULES:
• Use only one layer. If several layers exist in a design file, only the layer with the most references will be written.
• Maximum definition or reference depth is 50.
• The subroutine with the highest number definition will be taken as main routine.

Download Files

Files

SOP:

Heidelberg uPG SOP 2018

Spec Sheet:

muepg101.pdf

Member Files

Characterization:

Grayscale tests -1  Grayscale tests -2

Staff Files

Manuals:

Bios parameters -tool PC-

uPG101 UG3 User Manual Rev7

uPG101_PI1_Preinstallation_Guide.pdf

uPG101_UG1_Addendum_Option Multiple Exposure.pdf

uPG101_UG1_User_Manual_Rev5.pdf

SOP:

Heidelberg uPG SOP WORD

Special Instruction:

Parameter Array Test – Adjust

Special Instructions:

Scanscale Test – Adjust r1